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Circuit Board Fabrication Capabilities

Panel Size
• 6x9 Through 26x30
• Maximum Circuits Size 24x28

Construction
• Balanced
• Controlled Dielectric
• Controlled Impedance +/- 5% (2% Available)
• Blind & Buried Via
• Minimum Thickness .005
• Maximum Thickness .500
• Maximum Layers 50+
• Metallic Filled Vias
• Via in Pad

Line & Space
• Minimum LIne .003
• Minimum Space .003

Laminates & Materials
• Tetra/DI and Multi-Functional Tg 170
• Polyimide
• Rogers
• Thermount
• High Speed Nelco-13 and FR408
• Teflon/PTFE
• Speed Boards
• Minimum Cladding 1/4-oz.
• Maxiumum Cladding 10 oz.
• Minimum Core Thickness .002
• Maximum Core Thickness .125 to .500

Product Types
• 1 & 2 Sided and Multi-Layers
• Multi Chip Module
• Surface Mount
• Chip On Board
• Ball Grind Array

Delivery
• Nationwide 24 Hour Delivery

Solder Mask & Legend Inks
• Per IPC-SM-840
• Dryfilm
• Liquid Photoimagable
• S/M Colors: Green, Red, Blue, Black, Yellow, Clear and More
• Legend Inks: White, Red, Yellow, Black, Orange and More

Surface Finish
• Hot Air Solder Level
• Electroless Nickel/Immersion Gold
• Full Body Nickel/Gold - Hard or Soft Wire Bondable
• Selective Nicke/Gold
• Organic Surface Preservative
• Immersion Tin/Silver
• NI-PD-AU

Fabrication
• Single & Array Panel
• Beveling
• Countersink & Counterbore
• Edge/Controlled Depth Milling
• Scoring
• Back Drilling

Electrical Test
• 1 & 2 Sided SMD
• Dual Access Net List
• Flying Probe to 10 mil Pitch

Laboratory Testing
• Thermal Stress Cross Sections
• Ionic Contamination Testing
• TDR Impedance Verification
• Dielectric and Structural Integrity Verification

Drilling
• Minimum Drilled Hole .005
• Minimum Pad Size Over Finished Hole Size: Internal .012; External .010

Contact us today for an opportunity to provide a quote on your next up and coming requirement.